No.6360-95 T:170um PO:150um Adhesive:20um For high bumpy surface
日本獅力昂（Slion）UV晶片切割系列膠帶：
#6360-00，#6360-20，#6360-80，#6360-15，#6360-50,#6360-25
產品特點：以具有強等方性伸特性的聚烯烴作為底基，切割時可堅固地固定物體
用途：UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶，能使用於硅晶等，各種晶片的切割
NO.636095 Dicing tape (for Circuit Boards)
Dicing tapes (for circuit board) consit of higher isotropic olefin backing and UV peeling adhesive.
For all kinds of substrate dicing
Dicing tape(for Circuit Boards)
Easy pick up
Strong adhesion
Thickness (mm):0.170
| Test Item | Unit | Value | ||
| Adhesion | N/10mm | 4.10 | ||
| Tack | Ball No. | - | ||
| Holding power | Creep mm/24h | <0.1 | ||
| Adhesion | To UV | N/10mm | 0.10 | |
*Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N
