日本獅力昂（Slion）UV晶片切割系列膠帶：
#6360-00，#6360-20，#6360-80，#6360-15，#6360-50,#6360-25
產(chǎn)品特點：以具有強等方性伸特性的聚烯烴作為底基，切割時可堅固地固定物體
用途：UV照射後容易抽出晶片塗布UV剝離性膠粘劑的切割用膠帶，能使用於硅晶等，各種晶片的切割
Product IntroductionDicing tapes (for circuit board) consit of higher isotropic olefin backing and UV peeling adhesive.
For all kinds of substrate dicing
Dicing tape(for Circuit Boards)
Thickness (mm):0.160
| Test Item | Unit | Value | ||
| Adhesion | N/10mm | 2.80 | ||
| Tack | Ball No. | 6 | ||
| Holding power | Creep mm/24h | 0.1 | ||
| Adhesion | To UV | N/10mm | 0.23 | |
*Test Method: In accordance with sliontec method.
*Holding power: 40°C, 9.8 N
